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首页 > 供应产品 > Epson NX1032XS 集成电路测试机
- Epson NX1032XS 集成电路测试机
- 发布时间：2017/6/30 17:18:09 修改时间：2017/6/30 17:18:09 浏览次数：848
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Epson NX1032XS 集成电路测试机
NX1032XS   
Features - Transfers, inspects and sorts up to 20,000 logic ICs every hour
- 32-site simultaneous test capability.
- Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors.
Main specifications | | NX1032XS |
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| 16-site | 32-site | | Device type | QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA | | Min. 3x3 to Max. 50x50 (Lead pitch: 0.4 mm or more)*1 | | Test mode | - | 32-site (8x4) | | 16-site (8x2) | | 8-site (4x2) | | 4-site (2x2) | | 4-site (4x1) | | 2-site (2x1) | | Single | | Testing area | 344 mm x 146 mm | 344 mm x 244 mm | | Standard socket pitch (mm) | X:40 Y:60 | | Heating method | Heat press method | | Index time | 0.42 sec. (wide 4x2, 8x2 layout)*2
2.21 sec.(4,800N Option)*2 | 2.05 sec. (8x4 layout)*2
4.35 sec.(4,800N Option)*2 | | Min. 0.38 sec | | Max. throughput(pcs/hour) | 20,000 (Ambient), 10,500(high-temperature) | | Binning | Max. 6 bins (Auto 3, Manual 3) | | Tray size | JEDEC (135.9 x 315.0)mm | | Hot plate size | 220 x 380 mm 2pcs | | Max. contact pressure | 2,400 N (Standard) 4,800 N (otional) | | Temperature accuracy | +50degC to +90degC ±2degC | | +90degC to +155degC ±3degC | | Power requirement | Single phase AC 200 to 240V 50/60 Hz 6kVA | | Machine dimension (mm) | 1,940(W) x 1,580(D) x 2,000(H)*3 | | Total weight | Approx. 1,200 kg
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