CyberOptics SE-300 SPI锡膏厚度测试仪
KEEPING PACE WITH DEMANDING LINE SPEEDS CyberOptics? 100% 3D solder paste inspection system, the SE 300 Ultra, provides accurate and repeatable results at speeds that keep up with the increasing pace of your line. Using field-proven 3D vision sensing technology, the SE 300 Ultra is the best choice for optimizing your post-print inspection and process control. NEW FEATURES ? Multi-panel 1-D and 2-D barcode read using the system sensor ? Mechanical board stop solution ? Programming time improvement—less than 15 minutes with ODB++ file im
port ? Offline defect review capability ? Program call-up using bar code reader ? Robust flexible PCB warp compensation algorithm - Designed to compensate for complex warp within a field of view ? New optio
nal sensor with an extended height range—up to 24 mils (610 microns) FIELD-PROVEN TECHNOLOGY ? High-resolution 3D sensing technology to inspect the most demanding assemblies with even subtle printing errors ? High-speed/high-resolution inspection modes to optimize system performance ? 3D height, true volume and area measurements for those PCBs with CSPs, 0201s or other small pad sizes wher
e measuring solder volume is key for identifying solder joint reliability ? Registration measurement and bridge detection to help you fine-tune printer set up and mo
nitor process drift ? 3D shaded view for examining solder paste deposits ? XML file format output for easy integration to Shop Floor Co
ntrol systems SYSTEM ? 3D sensing system with built-in fiducial camera and lighting ? Adjustable-width, clamping co
nveyor system, retracts for easy board removal ? CD-RW, Ethernet connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive ? Pentium? 4 processor: data handling and image processing
3-D 焊膏检测系统 SE 300
