- Epson TR60 集成电路测试机
- 发布时间：2017/6/30 17:18:56 修改时间：2017/6/30 17:18:56 浏览次数：512
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Epson TR60 集成电路测试机
TR60 Series
Features
- High Reliability
- Low jam rate enabled by stable handling mechanism and special functions
- Jam rate less than 1/5,000 (actual reference rate: less than 1/20,000)
- High accuracy in temperature control
- Temperature can be controlled independently in each area
- High precision and stable temperature control with stable LN2 evaporation
- Flexibility tor various test sites
- 4-sites (square, In-Line)
- 2-sites
- 1-site
- High-speed index
- High throughput
- Small footprint (vertical docking)
Main specifications
TR60 Device type QFP, BGA, CSP, TSOP, PGA etc 3x3 to 32x32 Test mode 4-Sites (2x2) 4-Sites (4x2) 2-Sites (2x1) 4-Sites (1x2) 1-Sites (use one socket of 2site) 1-Sites (Center)*1 Heating method Heat press method Index time 0.65 sec- Max. throughput 4,000 UPH(Includes tray exchange time) Binning Max. 6 bins (Auto 3, Manual 3 Bins) Tray size JEDEC (135.9 x 315.0)mm, EIAJ Temperature accuracy +40degC to +140degC ±3degC -60degC to -40degC ±5degC*2 Soak(4site) 104 (26pcs) 136 (34pcs) Machine dimension (mm) 1,570(W) x 1,270(D) x 1880(H) Total weight 1,200 kg - High Reliability
