| | NX1032XS |
|---|
| 16-site | 32-site |
| Device type | QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA |
| Min. 3x3 to Max. 50x50 (Lead pitch: 0.4 mm or more)*1 |
| Test mode | - | 32-site (8x4) |
| 16-site (8x2) |
| 8-site (4x2) |
| 4-site (2x2) |
| 4-site (4x1) |
| 2-site (2x1) |
| Single |
| Testing area | 344 mm x 146 mm | 344 mm x 244 mm |
| Standard socket pitch (mm) | X:40 Y:60 |
| Heating method | Heat press method |
| Index time | 0.42 sec. (wide 4x2, 8x2 layout)*2
2.21 sec.(4,800N Option)*2 | 2.05 sec. (8x4 layout)*2
4.35 sec.(4,800N Option)*2 |
| Min. 0.38 sec |
| Max. throughput(pcs/hour) | 20,000 (Ambient), 10,500(high-temperature) |
| Binning | Max. 6 bins (Auto 3, Manual 3) |
| Tray size | JEDEC (135.9 x 315.0)mm |
| Hot plate size | 220 x 380 mm 2pcs |
| Max. contact pressure | 2,400 N (Standard) 4,800 N (otional) |
| Temperature accuracy | +50degC to +90degC ±2degC |
| +90degC to +155degC ±3degC |
| Power requirement | Single phase AC 200 to 240V 50/60 Hz 6kVA |
| Machine dimension (mm) | 1,940(W) x 1,580(D) x 2,000(H)*3 |
| Total weight | Approx. 1,200 kg
|
